Semiconductor light-emitting device

ABSTRACT

Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2019-049416, filed on Mar. 18, 2019, theentire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a semiconductor light-emitting device.

BACKGROUND

Semiconductor light-emitting devices having semiconductor light-emittingelements as light sources have been proposed. In the related art, anexample of a semiconductor light-emitting device is disclosed. Thesemiconductor light-emitting device disclosed in the related artincludes a plurality of LED chips as semiconductor light-emittingelements, a substrate on which the LED chips are mounted, and alight-transmitting resin part that covers the LED chips.

When a plurality of LED chips that emit, for example, red light, greenlight, and blue light are employed, the size of the semiconductorlight-emitting device may be increased and a defect in manufacture maybe caused by the arrangement of the plurality of LED chips.

SUMMARY

Some embodiments of the present disclosure provide a semiconductorlight-emitting device that can be miniaturized.

According to one embodiment of the present disclosure, there is provideda semiconductor light-emitting device. The semiconductor light-emittingdevice includes: a substrate having a base and a conductive part; afirst semiconductor light-emitting element, a second semiconductorlight-emitting element, and a third semiconductor light-emitting elementsupported by the substrate; at least one first wire connected to thefirst semiconductor light-emitting element, at least one second wireconnected to the second semiconductor light-emitting element, and athird wire connected to the third semiconductor light-emitting element;and a light-transmitting resin part covering the first semiconductorlight-emitting element, the second semiconductor light-emitting element,and the third semiconductor light-emitting element, wherein the base hasa main surface and a rear surface facing opposite sides to each other ina thickness direction of the base, wherein the conductive part includesa main surface part formed on the main surface, wherein the main surfacepart includes a main surface first part on which the first semiconductorlight-emitting element and the second semiconductor light-emittingelement are mounted, wherein the main surface first part reaches bothends of the main surface in a first direction perpendicular to thethickness direction of the base, and wherein the main surface first partis separated from both a part of the main surface part on which thethird semiconductor light-emitting element is mounted and a part of themain surface part to which the at least one first wire, the at least onesecond wire, and the third wire are connected.

Other features and advantages of the present disclosure will become moreapparent from the detailed description given below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view of a principal part illustrating a semiconductorlight-emitting device according to a first embodiment of the presentdisclosure.

FIG. 2 is a bottom view illustrating the semiconductor light-emittingdevice according to the first embodiment of the present disclosure.

FIG. 3 is a cross-sectional view taken along a line in FIG. 1.

FIG. 4 is a cross-sectional view taken along a line IV-IV in FIG. 1.

FIG. 5 is a cross-sectional view taken along a line V-V in FIG. 1.

FIG. 6 is a cross-sectional view taken along a line VI-VI in FIG. 1.

FIG. 7 is a cross-sectional view taken along a line VII-VII in FIG. 1.

FIG. 8 is a plan view illustrating a main surface first part of thesemiconductor light-emitting device according to the first embodiment ofthe present disclosure.

FIG. 9 is a plan view illustrating a main surface second part of thesemiconductor light-emitting device according to the first embodiment ofthe present disclosure.

FIG. 10 is a plan view of a principal part illustrating an example of amethod of manufacturing the semiconductor light-emitting deviceaccording to the first embodiment of the present disclosure.

FIG. 11 is a plan view of a principal part illustrating an example ofthe method of manufacturing the semiconductor light-emitting deviceaccording to the first embodiment of the present disclosure.

FIG. 12 is a plan view of a principal part illustrating an example ofthe method of manufacturing the semiconductor light-emitting deviceaccording to the first embodiment of the present disclosure.

FIG. 13 is a plan view of a principal part illustrating an example ofthe method of manufacturing the semiconductor light-emitting deviceaccording to the first embodiment of the present disclosure.

FIG. 14 is a plan view of a principal part illustrating a semiconductorlight-emitting device according to a second embodiment of the presentdisclosure.

FIG. 15 is a plan view illustrating a main surface first part of thesemiconductor light-emitting device according to the second embodimentof the present disclosure.

FIG. 16 is a plan view illustrating a main surface second part of thesemiconductor light-emitting device according to the second embodimentof the present disclosure.

FIG. 17 is a plan view of a principal part illustrating a semiconductorlight-emitting device according to a third embodiment of the presentdisclosure.

FIG. 18 is a plan view illustrating a main surface first part of thesemiconductor light-emitting device according to the third embodiment ofthe present disclosure.

FIG. 19 is a plan view illustrating a main surface second part of thesemiconductor light-emitting device according to the third embodiment ofthe present disclosure.

FIG. 20 is a plan view illustrating a main surface sixth part of thesemiconductor light-emitting device according to the third embodiment ofthe present disclosure.

DETAILED DESCRIPTION

Embodiments of the present disclosure will now be described in detailwith reference to the drawings.

The terms “first,” “second,” “third,” and the like herein are simplyused as labels, and are not necessarily intended to be ordered fortarget objects.

First Embodiment

FIGS. 1 to 9 illustrate a semiconductor light-emitting device accordingto a first embodiment of the present disclosure. A semiconductorlight-emitting device A1 of the present embodiment includes a substrate1, a first semiconductor light-emitting element 41, a secondsemiconductor light-emitting element 42, a third semiconductorlight-emitting element 43, two first wires 418, two second wires 428, athird wire 438, and a light-transmitting resin part 6. The semiconductorlight-emitting device A1 is configured as a light-emitting devicecapable of appropriately emitting red light, green light, and bluelight.

FIG. 1 is a plan view of a principal part illustrating the semiconductorlight-emitting device A1. FIG. 2 is a bottom view illustrating thesemiconductor light-emitting device A1. FIG. 3 is a cross-sectional viewtaken along a line in FIG. 1. FIG. 4 is a cross-sectional view takenalong a line IV-IV in FIG. 1. FIG. 5 is a cross-sectional view takenalong a line V-V in FIG. 1. FIG. 6 is a cross-sectional view taken alonga line VI-VI in FIG. 1. FIG. 7 is a cross-sectional view taken along aline VII-VII in FIG. 1. FIG. 8 is a plan view illustrating a mainsurface first part of the semiconductor light-emitting device A1. FIG. 9is a plan view illustrating a main surface second part of thesemiconductor light-emitting device A1. In these drawings, the lowerside in the plan view may be referred to as “one side in the ydirection” and the upper side in the plan view may be referred to as“the other side in they direction.” Further, the left side in the planview may be referred to as “one side in the x direction” and the rightside in the plan view may be referred to as “the other side in the xdirection.” Moreover, in FIG. 1, the light-transmitting resin part 6 isomitted for convenience of understanding.

The size and shape of the semiconductor light-emitting device A1 are notlimited at all. For example, the dimension in the x direction and thedimension in the y direction are each about 1.0 mm as the size of thesemiconductor light-emitting device A1.

<Substrate 1>

The substrate 1 serves as a base of the semiconductor light-emittingdevice A1. The substrate 1 includes a base 2, a conductive part 3, andan insulating layer 5.

<Base 2>

The base 2 is made of an insulating material. The insulating materialconstituting the base 2 is not limited at all, and may be, for example,a glass epoxy resin or the like. The base 2 includes a main surface 21,a rear surface 22, a first surface 23, a second surface 24, a thirdsurface 25, a fourth surface 26, and a plurality of groove parts 27.

As illustrated in FIGS. 1 to 7, the main surface 21 and the rear surface22 face opposite sides to each other in a z direction. In theillustrated example, the main surface 21 and the rear surface 22 areplanes perpendicular to the z direction. The shape of the base 2 is notparticularly limited, and is, for example, rectangular, as viewed in thez direction, as illustrated in FIGS. 1 and 2. The thickness of the base2 is, for example, about 0.2 mm.

The first surface 23 is a surface facing the x direction, and isconnected to the main surface 21 and the rear surface 22. The secondsurface 24 is a surface facing the opposite side of the first surface 23in the x direction, and is connected to the main surface 21 and the rearsurface 22. The third surface 25 is a surface facing the y direction,and is connected to the main surface 21 and the rear surface 22. Thefourth surface 26 is a surface facing the opposite side of the thirdsurface 25 in the y direction, and is connected to the main surface 21and the rear surface 22.

The plurality of groove parts 27 are installed at the corners of thebase 2 as viewed in the z direction. The groove parts 27 each extendalong the z direction and reach the main surface 21 and the rear surface22. In the illustrated example, the groove parts 27 each have a quarterarc shape as viewed in the z direction.

<Conductive Part 3>

The conductive part 3 is formed on the base 2, and provides a conductionpath to the first semiconductor light-emitting element 41, the secondsemiconductor light-emitting element 42, and the third semiconductorlight-emitting element 43, as well as a part for mounting the firstsemiconductor light-emitting element 41, and the second semiconductorlight-emitting element 42, and the third semiconductor light-emittingelement 43. The conductive part 3 is made of a conductive material, andis made of a metal such as Cu, Ni, Pd, Ti, Au, or the like. Aconfiguration in which a Cu plating layer is formed in an underlyingplating layer, which is formed on the base 2 and made of Ti and Cu, byelectrolytic plating may be used as a configuration example of theconductive part 3.

In the present embodiment, as illustrated in FIGS. 1 to 7, theconductive part 3 includes a main surface part 31, a rear surface part32, and a plurality of connection parts 33.

The main surface part 31 is formed on the main surface 21 of the base 2.In the illustrated example, the main surface part 31 includes a mainsurface first part 311, a main surface second part 312, a main surfacethird part 313, a main surface fourth part 314, and a main surface fifthpart 315. The thickness of the main surface part 31 is not particularlylimited, and is, for example, about 40 μm.

The main surface first part 311 includes a pad part 3111, a firstextension part 3112, and a second extension part 3113, as illustrated inFIGS. 1 and 8. As will be described in detail below, the main surfacefirst part 311 reaches both ends of the main surface 21 of the base 2 inthe x direction. Further, the main surface first part 311 is separatedfrom any other part of the main surface part 31.

The pad part 3111 is a part on which the first semiconductorlight-emitting element 41 and the second semiconductor light-emittingelement 42 are mounted. In the illustrated example, the pad part 3111includes a first side 3111 a, a second side 3111 b, a third side 3111 c,a fourth side 3111 d, a fifth side 3111 e, a sixth side 3111 f, aseventh side 3111 g, an eighth side 3111 h, a ninth side 3111 i, a tenthside 3111 j, and an eleventh side 3111 k, as illustrated in FIG. 8. InFIG. 8, the first semiconductor light-emitting element 41 and the secondsemiconductor light-emitting element 42 are indicated by imaginarylines.

The first side 3111 a is a side extending along the x direction. Thesecond side 3111 b is a side extending along the x direction, and islocated on one side of the first side 3111 a in the y direction. Thethird side 3111 c is a side extending along the x direction. The thirdside 3111 c is located on one side of the first side 3111 a in the xdirection, and is located on the other side thereof in they direction.The fourth side 3111 d is a side extending along the x direction. Thefourth side 3111 d is located on one side of the second side 3111 b inthe x direction, and is located on the other side thereof in the ydirection.

The fifth side 3111 e is a side extending along the y direction, and islocated between the first side 3111 a and the second side 3111 b in theydirection. The sixth side 3111 f is a side extending along theydirection. The sixth side 3111 f is located on one side of the fifthside 3111 e in the x direction. The sixth side 3111 f is located betweenthe third side 3111 c and the fourth side 3111 d in the y direction.

The seventh side 3111 g is interposed between the first side 3111 a andthe third side 3111 c, and connects them. In the illustrated example,the seventh side 3111 g is an S-shaped curve. The eighth side 3111 h isinterposed between the second side 3111 b and the fourth side 3111 d,and connects them. In the illustrated example, the eighth side 3111 h isan S-shaped curve.

The ninth side 3111 i is interposed between the fifth side 3111 e andthe second side 3111 b, and connects them. In the illustrated example,the ninth side 3111 i has a convex curve shape. The tenth side 3111 j isinterposed between the fourth side 3111 d and the sixth side 3111 f, andconnects them. In the illustrated example, the tenth side 3111 j has aconvex curve shape.

The first extension part 3112 extends from the pad part 3111 to theother side thereof in the x direction, and reaches an end edge (secondsurface 24) of the main surface 21 in the x direction. In theillustrated example, the first extension part 3112 includes a first side3112 a and a second side 3112 b, as illustrated in FIG. 8.

The first side 3112 a is a side on the other side of the first extensionpart 3112 in the y direction. In the illustrated example, the first side3112 a has a shape that is inclined with respect to the x direction. Thesecond side 3112 b is a side on one side of the first extension part3112 in the y direction. In the illustrated example, the second side3112 b has a concave curve shape.

The second extension part 3113 extends from the pad part 3111 to oneside thereof in the x direction, and reaches an end edge (first surface23) of the main surface 21 in the x direction. In the illustratedexample, the second extension part 3113 includes a first side 3113 a, asecond side 3113 b, a third side 3113 c, and a fourth side 3113 d, asillustrated in FIG. 8.

The first side 3112 a is a side on the other side of the secondextension part 3113 in the y direction. In the illustrated example, thefirst side 3113 a has a shape along the x direction. The second side3113 b is a side on one side of the second extension part 3113 in theydirection. In the illustrated example, the second side 3113 b has ashape along the x direction. The third side 3113 c is connected to oneside of the first side 3113 a in the x direction, and reaches the endedge (first surface 23) of the main surface 21 in the x direction. Inthe illustrated example, the third side 3113 c has a shape that isinclined with respect to the x direction. The fourth side 3113 d isconnected to one side of the second side 3113 b in the x direction, andreaches the end edge (first surface 23) of the main surface 21 in the xdirection. In the illustrated example, the fourth side 3113 d has ashape that is inclined with respect to the x direction.

The main surface second part 312 is located on one side of the firstsemiconductor light-emitting element 41 and the second semiconductorlight-emitting element 42 in the y direction, and is separated from themain surface first part 311. As illustrated in FIGS. 1 and 9, the mainsurface second part 312 includes a pad part 3121, a first extension part3122, a second extension part 3123, and an edge part 3124.

The pad part 3121 is a part on which the third semiconductorlight-emitting element 43 is mounted. Further, in the presentembodiment, the first wire 418 and the second wire 428 are connected tothe pad part 3121. In FIG. 9, the third semiconductor light-emittingelement 43, and a bonding part 4181 and a bonding part 4281 as describedlater are indicated by imaginary lines.

In the illustrated example, the pad part 3121 includes a first side 3121a, a second side 3121 b, a third side 3121 c, a fourth side 3121 d, afifth side 3121 e, a sixth side 3121 f, a seventh side 3121 g, an eighthside 3121 h, a ninth side 3121 i, a tenth side 3121 j, an eleventh side3121 k, a twelfth side 31211, a thirteenth side 3121 m, and a fourteenthside 3121 n, as illustrated in FIG. 9.

The first side 3121 a is a side extending along the x direction. Thesecond side 3121 b is a side extending along the x direction, and islocated on one side of the first side 3121 a in the y direction. Thethird side 3121 c is a side extending along the x direction. The thirdside 3121 c is located on one side of the first side 3121 a in the xdirection, and is located on the other side thereof in they direction.The fourth side 3121 d is a side extending along the x direction, and islocated on one side of the third side 3121 c in they direction. Thefourth side 3121 d is located on one side of the second side 3121 b inthe x direction, and is located on one side thereof in they direction.The fifth side 3121 e is a side extending along the x direction. Thefifth side 3121 e is located on one side of the third side 3121 c in thex direction, and is located on one side thereof in they direction. Also,the fifth side 3121 e is located on the other side of the first side3121 a in they direction. The sixth side 3121 f is a side inclined tothe x direction. The sixth side 3121 f is located on one side of thefourth side 3121 d in the x direction. Also, the sixth side 3121 f islocated between the fifth side 3121 e and the fourth side 3121 d in theydirection.

The seventh side 3121 g is a side extending along they direction. Theseventh side 3121 g is located between the first side 3121 a and thesecond side 3121 b in they direction. The eighth side 3121 h is a sideextending along they direction. The eighth side 3121 h is locatedbetween the fifth side 3121 e and the sixth side 3121 f in theydirection.

The ninth side 3121 i is interposed between the first side 3121 a andthe third side 3121 c, and connects them. In the illustrated example,the ninth side 3121 i is an S-shaped curve. The tenth side 3121 j isinterposed between the third side 3121 c and the fifth side 3121 e, andconnects them. In the illustrated example, the tenth side 3121 j is anS-shaped curve.

The eleventh side 3121 k is interposed between the fifth side 3121 e andthe eighth side 3121 h, and connects them. In the illustrated example,the eleventh side 3121 k has a convex curve shape. The twelfth side31211 is interposed between the seventh side 3121 g and the second side3121 b, and connects them. In the illustrated example, the twelfth side31211 has a convex curve shape. The thirteenth side 3121 m is interposedbetween the fourth side 3121 d and the sixth side 3121 f, and connectsthem. In the illustrated example, the thirteenth side 3121 m has aconvex curve shape. The fourteenth side 3121 n is interposed between thesixth side 3121 f and the eighth side 3121 h, and connects them. In theillustrated example, the fourteenth side 3121 n has a convex curveshape.

The first extension part 3122 extends from the other side part of thepad part 3121 in the x direction, as illustrated in FIG. 9. In theillustrated example, the first extension part 3122 includes a first side3122 a, a second side 3122 b, a third side 3122 c, a fourth side 3122 d,and a fifth side 3122 e.

The first side 3122 a is a side extending along the x direction. In theillustrated example, the first side 3122 a is connected to the firstside 3121 a of the pad part 3121. The second side 3122 b is located onone side of the first side 3122 a in they direction. In the illustratedexample, the second side 3122 b is connected to the seventh side 3121 gof the pad part 3121. The third side 3122 c is located on the other sideof the first side 3122 a in the x direction, and is inclined withrespect to the x direction. The fourth side 3122 d is located on theother side of the second side 3122 b in the x direction, and is inclinedwith respect to the x direction. The fifth side 3122 e is interposedbetween the first side 3122 a and the third side 3122 c, and connectsthem.

The second extension part 3123 extends from one side part of the padpart 3121 in the y direction, and reaches an end edge (fourth surface26) of the main surface 21 in the y direction, as illustrated in FIGS. 1and 9. As illustrated in FIG. 9, in the illustrated example, the secondextension part 3123 has a first side 3123 a, a second side 3123 b, athird side 3123 c, and a fourth side 3123 d.

The first side 3123 a extends along the y direction and reaches the endedge (fourth surface 26) of the main surface 21 in they direction. Thethird side 3123 c extends along the y direction, and is located on oneside of the second extension part 3123 in the x direction. The thirdside 3123 c reaches the end edge (fourth surface 26) of the main surface21 in the y direction. The second side 3123 b is interposed between thefirst side 3123 a and the second side 3121 b of the pad part 3121, andconnects them. In the illustrated example, the second side 3123 b has aconcave curve shape. The fourth side 3123 d is interposed between thethird side 3123 c and the fourth side 3121 d of the pad part 3121, andconnects them. In the illustrated example, the fourth side 3123 d has aconcave curve shape.

As illustrated in FIGS. 1 and 9, the edge part 3124 is connected to thefirst extension part 3122, and has a shape along the groove part 27 ofthe base 2 as viewed in the z direction. As illustrated in FIG. 9, inthe illustrated example, the edge part 3124 has a first side 3124 a, asecond side 3124 b, and a third side 3124 c.

The first side 3124 a has a convex arc shape, and is installed at aposition facing the twelfth side 31211 of the pad part 3121 in theillustrated example. The second side 3124 b has a convex arc shape, andis installed on the opposite side of the first side 3124 a with thefirst extension part 3122 interposed therebetween. The first side 3124 aand the second side 3124 b have a relationship that forms the same arcwhen they are each extended. The third side 3124 c has a concave arcshape. The third side 3124 c is installed near the groove part 27 withrespect to the first side 3124 a and the second side 3124 b.

The main surface third part 313 includes a pad part 3131, a firstextension part 3132, and an edge part 3134, as illustrated in FIG. 1.

The pad part 3131 is arranged separately from the pad part 3111 of themain surface first part 311 on the other side thereof in they direction.The shape of the pad part 3131 is not particularly limited, and issubstantially rectangular in the illustrated example. The first wire 418is connected to the pad part 3131.

The first extension part 3132 extends from the pad part 3131 toward thegroove part 27. The edge part 3134 is connected to the first extensionpart 3132, and has a shape along the groove part 27 of the base asviewed in the z direction.

The main surface fourth part 314 includes a pad part 3141, a firstextension part 3142, a main surface fourth part 3143, and an edge part3144, as illustrated in FIG. 1.

The pad part 3141 is arranged separately from the pad part 3111 of themain surface first part 311 on the other side thereof in the ydirection, and is arranged separately from the pad part 3131 of the mainsurface third part 313 on one side thereof in the x direction. The shapeof the pad part 3141 is not particularly limited, and is substantiallyrectangular in the illustrated example. The second wire 428 is connectedto the pad part 3141.

The first extension part 3142 extends from the pad part 3141 toward thegroove part 27. The main surface fourth part 3143 extends from the padpart 3131 to the other side thereof in the y direction, and reaches anend edge (third surface 25) of the main surface 21 in they direction.The edge part 3144 is connected to the first extension part 3142, andhas a shape along the groove part 27 of the base as viewed in the zdirection.

The main surface fifth part 315 includes a pad part 3151, a firstextension part 3152, and an edge part 3154, as illustrated in FIG. 1.

The pad part 3151 is arranged separately from the pad part 3111 of themain surface first part 311 on one side thereof in the x direction. Theshape of the pad part 3151 is not particularly limited, and issubstantially rectangular in the illustrated example. The third wire 438is connected to the pad part 3151.

The first extension part 3152 extends from the pad part 3151 to one sidethereof in the y direction, and extends toward the groove part 27. Theedge part 3154 is connected to the first extension part 3152 and has ashape along the groove part 27 of the base as viewed in the z direction.

The rear surface part 32 is formed on the main surface 21 of the base 2,as illustrated in FIG. 2. In the illustrated example, the rear surfacepart 32 includes a rear surface first part 321, a rear surface secondpart 322, a rear surface third part 323, and a rear surface fourth part324. The thickness of the rear surface part 32 is not particularlylimited, and is, for example, about 40 pin. Further, for example, solderplating or Sn plating may be formed on the surface layer of the rearsurface part 32.

The rear surface first part 321 overlaps the main surface second part312 of the main surface part 31 as viewed in the z direction. In theillustrated example, the rear surface first part 321 includes a firstside 321 a, a second side 321 b, a third side 321 c, a fourth side 321d, a fifth side 321 e, a sixth side 321 f, a seventh side 321 g, aneighth side 321 h, a ninth side 321 i, and a tenth side 321 j.

The first side 321 a extends along the x direction. The second side 321b extends along they direction. The third side 321 c extends along theydirection and is located on the other side of the second side 321 b inthe x direction. The fourth side 321 d extends along the x direction andis located on one side of the first side 321 a in they direction. Thefifth side 321 e has an arc shape along the groove part 27 of the base2. The sixth side 321 f is interposed between the first side 321 a andthe second side 321 b, and connects them. In the illustrated example,the sixth side 321 f has a convex curve shape. The seventh side 321 g isinterposed between the first side 321 a and the third side 321 c, andconnects them. In the illustrated example, the seventh side 321 g has aconvex curve shape. The eighth side 321 h is interposed between thesecond side 321 b and the fourth side 321 d, and connects them. In theillustrated example, the eighth side 321 h has a convex curve shape. Theninth side 321 i is connected to the third side 321 c and reaches theother side end (second surface 24) of the rear surface 22 in the xdirection. In the illustrated example, the ninth side 321 i has aconcave curve shape. The tenth side 321 j is connected to the fourthside 321 d and reaches one side end (fourth surface 26) of the rearsurface 22 in they direction. In the illustrated example, the tenth side321 j has a concave curve shape.

The rear surface second part 322 overlaps the main surface third part313 of the main surface part 31 as viewed in the z direction. In theillustrated example, the rear surface second part 322 includes a firstside 322 a, a second side 322 b, a third side 322 c, a fourth side 322d, a fifth side 322 e, a sixth side 322 f, a seventh side 322 g, aneighth side 322 h, a ninth side 322 i, and a tenth side 322 j.

The first side 322 a extends along the x direction. The second side 322b extends along the y direction. The third side 322 c extends along they direction and is located on the other side of the second side 322 b inthe x direction. The fourth side 322 d extends along the x direction andis located on the other side of the first side 322 a in they direction.The fifth side 322 e has an arc shape along the groove part 27 of thebase 2. The sixth side 322 f is interposed between the first side 322 aand the second side 322 b, and connects them. In the illustratedexample, the sixth side 322 f has a convex curve shape. The seventh side322 g is interposed between the first side 322 a and the third side 322c, and connects them. In the illustrated example, the seventh side 322 ghas a convex curve shape. The eighth side 322 h is interposed betweenthe second side 322 b and the fourth side 322 d, and connects them. Inthe illustrated example, the eighth side 322 h has a convex curve shape.The ninth side 322 i is connected to the third side 322 c and reachesthe other side end (second surface 24) of the rear surface 22 in the xdirection. In the illustrated example, the ninth side 322 i has aconcave curve shape. The tenth side 322 j is connected to the fourthside 322 d and reaches the other side end (third surface 25) of the rearsurface 22 in the y direction. In the illustrated example, the tenthside 322 j has a concave curve shape.

The rear surface third part 323 overlaps the main surface fourth part314 of the main surface part 31 as viewed in the z direction. In theillustrated example, the rear surface third part 323 includes a firstside 323 a, a second side 323 b, a third side 323 c, a fourth side 323d, a fifth side 323 e, a sixth side 323 f, a seventh side 323 g, aneighth side 323 h, a ninth side 323 i, and a tenth side 323 j.

The first side 323 a extends along the x direction. The second side 323b extends along the y direction. The third side 323 c extends along they direction and is located on one side of the second side 323 b in the xdirection. The fourth side 323 d extends along the x direction and islocated on one side of the first side 323 a in they direction. The fifthside 323 e has an arc shape along the groove part 27 of the base 2. Thesixth side 323 f is interposed between the first side 323 a and thesecond side 323 b, and connects them. In the illustrated example, thesixth side 323 f has a convex curve shape. The seventh side 323 g isinterposed between the first side 323 a and the third side 323 c, andconnects them. In the illustrated example, the seventh side 323 g has aconvex curve shape. The eighth side 323 h is interposed between thesecond side 323 b and the fourth side 323 d, and connects them. In theillustrated example, the eighth side 323 h has a convex curve shape. Theninth side 323 i is connected to the third side 323 c and reaches oneside end (first surface 23) of the rear surface 22 in the x direction.In the illustrated example, the ninth side 323 i has a concave curveshape. The tenth side 323 j is connected to the fourth side 323 d andreaches the other side end (third surface 25) of the rear surface 22 inthe y direction. In the illustrated example, the tenth side 323 j has aconcave curve shape.

The rear surface fourth part 324 overlaps the main surface fifth part315 of the main surface part 31 as viewed in the z direction. In theillustrated example, the rear surface fourth part 324 includes a firstside 324 a, a second side 324 b, a third side 324 c, a fourth side 324d, a fifth side 324 e, a sixth side 324 f, a seventh side 324 g, aneighth side 324 h, a ninth side 324 i, and a tenth side 324 j.

The first side 324 a extends along the x direction. The second side 324b extends along the y direction. The third side 324 c extends along they direction and is located on one side of the second side 324 b in the xdirection. The fourth side 324 d extends along the x direction and islocated on the other side of the first side 324 a in they direction. Thefifth side 324 e has an arc shape along the groove part 27 of the base2. The sixth side 324 f is interposed between the first side 324 a andthe second side 324 b, and connects them. In the illustrated example,the sixth side 324 f has a convex curve shape. The seventh side 324 g isinterposed between the first side 324 a and the third side 324 c, andconnects them. In the illustrated example, the seventh side 324 g has aconvex curve shape. The eighth side 324 h is interposed between thesecond side 324 b and the fourth side 324 d, and connects them. In theillustrated example, the eighth side 324 h has a convex curve shape. Theninth side 324 i is connected to the third side 324 c and reaches oneside end (first surface 23) of the rear surface 22 in the x direction.In the illustrated example, the ninth side 324 i has a concave curveshape. The tenth side 324 j is connected to the fourth side 324 d andreaches one side end (fourth surface 26) of the rear surface 22 in the ydirection. In the illustrated example, the tenth side 324 j has aconcave curve shape.

Each of the plurality of connection parts 33 connects part of the mainsurface part 31 and part of the rear surface part 32. As illustrated inFIG. 3, the plurality of connection parts 33 are formed along theplurality of groove parts 27. In the illustrated example, the pluralityof connection parts 33 include a first connection part 331, a secondconnection part 332, a third connection part 333, and a fourthconnection part 334.

As illustrated in FIGS. 1 and 2, the first connection part 331 connectsthe edge part 3124 of the main surface second part 312 of the mainsurface part 31 and the rear surface first part 321 of the rear surfacepart 32. The second connection part 332 connects the edge part 3134 ofthe main surface third part 313 of the main surface part 31 and the rearsurface second part 322 of the rear surface part 32. The thirdconnection part 333 connects the edge part 3144 of the main surfacefourth part 314 of the main surface part 31 and the rear surface thirdpart 323 of the rear surface part 32. The fourth connection part 334connects the edge part 3154 of the main surface fifth part 315 of themain surface part 31 and the rear surface fourth part 324 of the rearsurface part 32.

<Insulating Layer 5>

The insulating layer 5 is formed at a suitable position on the mainsurface 21 and the rear surface 22 of the base 2. The material of theinsulating layer 5 is not particularly limited and is an insulatingresin or the like, and it is formed of, for example, a resist film. Inthe present embodiment, the insulating layer 5 includes a first part 51,a second part 52, a third part 53, a fourth part 54, and a rear surfacepart 58.

The first part 51, the second part 52, the third part 53, and the fourthpart 54 are installed on the main surface 21 side in the z direction. Asillustrated in FIG. 1, the first part 51 covers the groove part 27 fromthe z direction. Also, the first part 51 covers the edge part 3124 ofthe main surface second part 312. The shape of the first part 51 is notparticularly limited, and is a quarter circle shape in the illustratedexample. The second part 52 covers the groove part 27 from the zdirection. Also, the second part 52 covers the edge part 3134 of themain surface third part 313. The shape of the second part 52 is notparticularly limited, and is a quarter circle shape in the illustratedexample. The third part 53 covers the groove part 27 from the zdirection. Also, the third part 53 covers the edge part 3144 of the mainsurface fourth part 314. The shape of the third part 53 is notparticularly limited, and is a quarter circle shape in the illustratedexample. The fourth part 54 covers the groove part 27 from the zdirection. Also, the fourth part 54 covers the edge part 3154 of themain surface fifth part 315. The shape of the fourth part 54 is notparticularly limited, and is a quarter circle shape in the illustratedexample.

The rear surface part 58 is installed on the rear surface 22 side in thez direction. As illustrated in FIG. 2, in the illustrated example, therear surface part 58 has a first part 581, a second part 582, a thirdpart 583, and a fourth part 584.

The first part 581 is a band-shaped part extending along the xdirection. The first part 581 is located between the rear surface firstpart 321 and the rear surface second part 322 in the y direction. Thesecond part 582 is a band-shaped part extending along the x direction.The second part 582 is located between the rear surface third part 323and the rear surface fourth part 324 in they direction. The third part583 is a band-shaped part extending along they direction. The third part583 is located between the rear surface second part 322 and the rearsurface third part 323 in the x direction. The fourth part 584 is aband-shaped part extending along the y direction. The fourth part 584 islocated between the rear surface first part 321 and the rear surfacefourth part 324 in the x direction.

<First Semiconductor Light-Emitting Element 41>

The first semiconductor light-emitting element 41 is a light sourceelement of the semiconductor light-emitting device A1, and its specificconfiguration is not limited at all. For example, an LED chip, asemiconductor laser element, a VCSEL element, or the like may be used asthe first semiconductor light-emitting element 41. In the followingdescription, a case where the first semiconductor light-emitting element41 is an LED chip will be described as an example.

In the present embodiment, the first semiconductor light-emittingelement 41 emits green light. As illustrated in FIG. 1, the firstsemiconductor light-emitting element 41 is mounted on the pad part 3111of the main surface first part 311 of the main surface part 31. Thefirst semiconductor light-emitting element 41 includes an electrode 411and an electrode 412. The electrode 411 and the electrode 412 arearranged on a side where the main surface 21 faces in the z direction.In the illustrated example, the electrode 411 is an anode electrode andthe electrode 412 is a cathode electrode.

The first semiconductor light-emitting element 41 is bonded to the padpart 3111 of the main surface first part 311 by a first bonding material419. The first bonding material 419 is an insulating bonding material,for example, an epoxy resin or a silicone resin.

<Second Semiconductor Light-Emitting Element 42>

The second semiconductor light-emitting element 42 is a light sourceelement of the semiconductor light-emitting device A1, and its specificconfiguration is not limited at all. For example, an LED chip, asemiconductor laser element, a VCSEL element, or the like may be used asthe second semiconductor light-emitting element 42. In the followingdescription, a case where the second semiconductor light-emittingelement 42 is an LED chip will be described as an example.

In the present embodiment, the second semiconductor light-emittingelement 42 emits blue light. As illustrated in FIG. 1, the secondsemiconductor light-emitting element 42 is mounted on the pad part 3111of the main surface first part 311 of the main surface part 31. Thesecond semiconductor light-emitting element 42 is arranged on one sideof the first semiconductor light-emitting element 41 in the x direction.The second semiconductor light-emitting element 42 includes an electrode421 and an electrode 422. The electrode 421 and the electrode 422 arearranged on a side where the main surface 21 faces in the z direction.In the illustrated example, the electrode 421 is an anode electrode andthe electrode 422 is a cathode electrode.

The second semiconductor light-emitting element 42 is bonded to the padpart 3111 of the main surface first part 311 by a second bondingmaterial 429. The second bonding material 429 is an insulating bondingmaterial, for example, an epoxy resin or a silicone resin similar to thefirst bonding material 419.

<Third Semiconductor Light-Emitting Element 43>

The third semiconductor light-emitting element 43 is a light sourceelement of the semiconductor light-emitting device A1, and its specificconfiguration is not limited at all. For example, an LED chip, asemiconductor laser element, a VCSEL element, or the like may be used asthe third semiconductor light-emitting element 43. In the followingdescription, a case where the third semiconductor light-emitting element43 is an LED chip will be described as an example.

In the present embodiment, the third semiconductor light-emittingelement 43 emits red light. As illustrated in FIG. 1, the thirdsemiconductor light-emitting element 43 is mounted on the pad part 3121of the main surface second part 312 of the main surface part 31. Asillustrated in FIGS. 1 and 6, the third semiconductor light-emittingelement 43 has an electrode 431 and an electrode 432. The electrode 431is arranged on a side where the main surface 21 faces in the zdirection. The electrode 432 is arranged on a side where the rearsurface 22 faces in the z direction. In the illustrated example, theelectrode 431 is a cathode electrode and the electrode 432 is an anodeelectrode.

The third semiconductor light-emitting element 43 is bonded to the padpart 3121 of the main surface second part 312 by a third bondingmaterial 439. The third bonding material 439 is a conductive bondingmaterial, for example, solder or Ag paste.

<First Wire 418>

The two first wires 418 are connected to the first semiconductorlight-emitting element 41. One first wire 418 is connected to theelectrode 411 of the first semiconductor light-emitting element 41 andthe pad part 3121 of the main surface second part 312. The bonding part4181 of the first wire 418 connected to the pad part 3121 is arranged onthe other side of the third semiconductor light-emitting element 43 inthe x direction. The other first wire 418 is connected to the electrode412 of the first semiconductor light-emitting element 41 and the padpart 3131 of the main surface third part 313. The material of the firstwires 418 is not particularly limited, and is, for example, Au.

<Second Wire 428>

The two second wires 428 are connected to the second semiconductorlight-emitting element 42. One second wire 428 is connected to theelectrode 421 of the second semiconductor light-emitting element 42 andthe pad part 3121 of the main surface second part 312. The bonding part4281 of the second wire 428 connected to the pad part 3121 is locatedbetween the third semiconductor light-emitting element 43 and thebonding part 4181 of the first wire 418 in the x direction. The othersecond wire 428 is connected to the electrode 422 of the secondsemiconductor light-emitting element 42 and the pad part 3141 of themain surface fourth part 314. The material of the second wires 428 isnot particularly limited, and is, for example, Au.

<Third Wire 438>

The single third wire 438 is connected to the third semiconductorlight-emitting element 43. The third wire 438 is connected to theelectrode 431 of the third semiconductor light-emitting element 43 andthe pad part 3151 of the main surface fifth part 315. The material ofthe third wire 438 is not particularly limited, and is, for example, Au.

<Light-transmitting Resin Part 6>

The light-transmitting resin part 6 is formed on the main surface 21side of the base 2 as illustrated in FIGS. 3 to 7, and covers the firstsemiconductor light-emitting element 41, the second semiconductorlight-emitting element 42, the third semiconductor light-emittingelement 43, the two first wires 481, the two second wires 482, and thethird wire 438. The light-transmitting resin part 6 is made of amaterial that transmits light from the first semiconductorlight-emitting element 41, the second semiconductor light-emittingelement 42, and the third semiconductor light-emitting element 43, anduses, for example, an epoxy resin or a silicone resin as a maincomponent. In the present embodiment, the light-transmitting resin part6 is transparent, but may be translucent.

Next, an example of a method of manufacturing the semiconductorlight-emitting device A1 will be described with reference to FIGS. 10 to13.

First, as illustrated in FIG. 10, a substrate 1A is prepared. Thesubstrate 1A is made of a substrate material capable of forming aplurality of substrates 1 of the semiconductor light-emitting device A1described above. The substrate 1A includes a base 2A, a conductive part3A, and insulating layers 5A. The base 2A is a plate material capable offorming a plurality of bases 2. The conductive part 3A is a conductivepart that becomes the conductive part 3 described above. The insulatinglayers 5A are insulating parts that become the insulating layers 5described above.

In the present embodiment, a plurality of through holes 27A are formedin the base 2. The through holes 27A are parts that become the grooveparts 27 by being divided at a subsequent step.

In the conductive part 3A, a plurality of main surface first parts 311are arranged side by side in the x direction and are connected to eachother. In addition, the main surface second part 312, the main surfacethird part 313, the main surface fourth part 314, and the main surfacefifth part 315 are connected to each other. The main surface first part311, the main surface second part 312, the main surface third part 313,the main surface fourth part 314, and the main surface fifth part 315are connected to a frame part 34. The frame part 34 is a part thatfunctions as, for example, a plating electrode for forming theconductive part 3A.

The insulating layers 5A have a plurality of circular parts 50. Thecircular parts 50 are parts that become the first part 51, the secondpart 52, the third part 53, and the fourth part 54 by being divided at asubsequent step.

Next, as illustrated in FIG. 11, the first semiconductor light-emittingelement 41, the second semiconductor light-emitting element 42, and thethird semiconductor light-emitting element 43 are mounted. When mountingthe first semiconductor light-emitting element 41 and the secondsemiconductor light-emitting element 42, the first semiconductorlight-emitting element 41 and the second semiconductor light-emittingelement 42 are adhered to the pad part 3111 of the main surface firstpart 311 by, for example, an insulating liquid resin material, to formthe first bonding material 419 and the second bonding material 429described above by curing the resin material. In addition, when mountingthe third semiconductor light-emitting element 43, the thirdsemiconductor light-emitting element 43 is bonded to the pad part 3121of the main surface second part 312 by, for example, solder or Ag paste.

Next, as illustrated in FIG. 12, the first wires 418, the second wires428, and the third wire 438 are each bonded. Then, a resin member (notshown) made of a light-transmitting resin is formed on the main surface21 side of the base 2A so as to cover the first semiconductorlight-emitting element 41, the second semiconductor light-emittingelement 42, the third semiconductor light-emitting element 43, the firstwires 418, the second wires 428, and the third wire 438. Thereafter, asillustrated in FIG. 13, the substrate 1A and the resin member are cutalong a cutting line CLx and a cutting line CLy. In FIG. 13, the resinmember is omitted for convenience of understanding. A plurality ofsemiconductor light-emitting devices A1 can be obtained through theaforementioned steps.

Next, an operation of the semiconductor light-emitting device A1 will bedescribed.

According to the present embodiment, as illustrated in FIG. 1, the mainsurface first part 311 including the pad part 3111 on which the firstsemiconductor light-emitting element 41 and the second semiconductorlight-emitting element 42 are mounted is separated from any of the mainsurface second part 312, the main surface third part 313, the mainsurface fourth part 314, and the main surface fifth part 315, which areother parts of the main surface part 31. Therefore, the first bondingmaterial 419 and the second bonding material 429 for bonding the firstsemiconductor light-emitting element 41 and the second semiconductorlight-emitting element 42 can be suppressed from reaching the mainsurface second part 312, the main surface third part 313, the mainsurface fourth part 314, and the main surface fifth part 315, and thebonding of the third semiconductor light-emitting element 43 or thebonding of the first wires 418, the second wires 428, and the third wire438 can be performed in a more suitable state. Accordingly, unnecessaryseparation of the first semiconductor light-emitting element 41 and thesecond semiconductor light-emitting element 42 from the thirdsemiconductor light-emitting element 43 and the like is not forced.Thus, it is possible to promote miniaturization of the semiconductorlight-emitting device A1.

Moreover, the main surface first part 311 reaches both ends of the mainsurface 21 in the x direction by having the first extension part 3112and the second extension part 3113. In the manufacturing process of thesemiconductor light-emitting device A1 having such a configuration, asillustrated in FIG. 10, the substrate 1A including the conductive part3A including the plurality of main surface first parts 311 connected toeach other may be used. According to the substrate 1A, the plurality ofmain surface first parts 311 are electrically connected to, for example,the frame part 34, thereby suitably performing plating treatment.

In the present embodiment, the first semiconductor light-emittingelement 41 and the second semiconductor light-emitting element 42 arebonded to the pad part 3111 by the insulating first bonding material 419and second bonding material 429. The insulating first bonding material419 and second bonding material 429 made of resin or the like are likelyto spread when formed as compared to the solder or the like. Accordingto the present embodiment, even if the first bonding material 419 andthe second bonding material 429 spread, it is possible to suppress themfrom reaching the main surface second part 312, the main surface thirdpart 313, the main surface fourth part 314, and the main surface fifthpart 315.

FIGS. 14 to 20 illustrate other embodiments of the present disclosure.Further, in these drawings, the same or similar elements as those in theaforementioned embodiment are denoted by the same reference numerals asthose in the aforementioned embodiment.

Second Embodiment

FIGS. 14 to 16 illustrate a semiconductor light-emitting deviceaccording to a second embodiment of the present disclosure. Asemiconductor light-emitting device A2 of the present embodiment isdifferent from the semiconductor light-emitting device A1 describedabove, mainly in the configuration of the main surface part 31.

As illustrated in FIG. 15, the pad part 3111 of the main surface firstpart 311 of the present embodiment has a first side 3111 a, a secondside 3111 b, a fifth side 3111 e, a tenth side 3111 j, and a sixth side3111 f.

The first side 3111 a extends along the x direction. The second side3111 b extends along the x direction, and is located on one side of thefirst side 3111 a in the y direction.

The fifth side 3111 e extends along they direction, and is locatedbetween the first side 3111 a and the second side 3111 b in theydirection. The sixth side 3111 f extends along the y direction. Thesixth side 3111 f is located on one side of the fifth side 3111 e in thex direction, and is located between the first side 3111 a and the secondside 3111 b in they direction.

The tenth side 3111 j is interposed between the second side 3111 b andthe fifth side 3111 e, and connects them. In the illustrated example,the tenth side 3111 j has a convex curve shape. The eleventh side 3111 kis interposed between the second side 3111 b and the sixth side 3111 f,and connects them. In the illustrated example, the eleventh side 3111 khas a convex curve shape.

The first extension part 3112 of the present embodiment has a first side3112 a and a second side 3112 b. The first side 3112 a extends along thex direction and is connected to the first side 3111 a of the pad part3111. The second side 3112 b is located on one side of the first side3112 a in they direction. The second side 3112 b is connected to thefifth side 3111 e of the pad part 3111, and has a concave curve shape inthe illustrated example.

The second extension part 3113 of the present embodiment includes afirst side 3113 a and a second side 3113 b. The first side 3113 aextends along the x direction and is connected to the first side 3111 aof the pad part 3111. The second side 3113 b is located on one side ofthe first side 3113 a in they direction, and is connected to the sixthside 3111 f of the pad part 3111.

As illustrated in FIG. 16, the pad part 3121 of the main surface secondpart 312 of the present embodiment includes a first side 3121 a, asecond side 3121 b, a third side 3121 c, a fourth side 3121 d, a fifthside 3121 e, a sixth side 2121 f, a seventh side 3121 g, an eighth side3121 h, a ninth side 3121 i, a tenth side 3121 j, an eleventh side 3121k, a twelfth side 31211, a thirteenth side 3121 m, a fourteenth side3121 n, a fifteenth side 3121 o, a sixteenth side 3121 p, a seventeenthside 3121 q, an eighteenth side 3121 r, a nineteenth side 3121 s, atwentieth side 3121 t, a twenty-first side 3121 u, a twenty-second side3121 v, a twenty-third side 3121 w, a twenty-fourth side 3121 x, atwenty-fifth side 3121 y, a twenty-sixth side 3121 z, a twenty-seventhside 31211, a twenty-eighth side 31212, and a twenty-ninth side 31213.

The first side 3121 a has a shape along the x direction. The second side3121 b has a shape along the x direction. The second side 3121 b islocated on one side of the first side 3121 a in the x direction and onone side thereof in they direction. The third side 3121 c has a shapealong the x direction. The third side 3121 c is located on one side ofthe second side 3121 b in the x direction and on the other side thereofin they direction. The position of the third side 3121 c in theydirection is substantially the same as the position of the first side3121 a in the y direction.

The fourth side 3121 d has a shape along the x direction. The fourthside 3121 d is located on one side of the first side 3121 a in theydirection. The fifth side 3121 e has a shape along the x direction. Thefifth side 3121 e is located on one side of the second side 3121 b inthey direction. Also, the fifth side 3121 e is located on one side ofthe fourth side 3121 d in the x direction and on one side thereof inthey direction. The sixth side 3121 f has a shape along the x direction.The sixth side 3121 f is located on one side of the third side 3121 c inthe y direction. Also, the sixth side 3121 f is located on one side ofthe fifth side 3121 e in the x direction, and thus has substantially thesame position in the y direction.

The seventh side 3121 g has a shape along they direction. The seventhside 3121 g is located on the other side of the first side 3121 a andthe fourth side 3121 d in the x direction. The eighth side 3121 h has ashape along they direction. The eighth side 3121 h is located betweenthe first side 3121 a and the second side 3121 b in the x direction andthey direction. The ninth side 3121 i has a shape along they direction.The ninth side 3121 i is located on one side of the second side 3121 bin the x direction and on one side thereof in they direction. The tenthside 3121 j has a shape along they direction. The tenth side 3121 j islocated on one side of the ninth side 3121 i in the x direction, andfaces the ninth side 3121 i. The eleventh side 3121 k has a shape alongthey direction. The eleventh side 3121 k is located on one side of thethird side 3121 c and the sixth side 3121 f in the x direction, and islocated between the third side 3121 c and the sixth side 3121 f in theydirection. The twenty-ninth side 31213 has a shape along they direction.The twenty-ninth side 31213 is located between the fourth side 3121 dand the fifth side 3121 e in the x direction and they direction.

The twelfth side 31211 is inclined with respect to the x direction andthey direction. The twelfth side 31211 is located between the first side3121 a and the seventh side 3121 g in the x direction and theydirection. The thirteenth side 3121 m is inclined with respect to the xdirection and they direction. The thirteenth side 3121 m is locatedbetween the sixth side 3121 f and the eleventh side 3121 k in the xdirection and they direction. The twenty-sixth side 3121 z is inclinedwith respect to the x direction and they direction. The twenty-sixthside 3121 z is located between the fifth side 3121 e and thetwenty-ninth side 31213 in the x direction and the y direction.

The fourteenth side 3121 n is located between the seventh side 3121 gand the twelfth side 31211, and connects them. In the illustratedexample, the fourteenth side 3121 n has a convex curve shape. Thefifteenth side 31210 is located between the first side 3121 a and thetwelfth side 31211, and connects them. In the illustrated example, thefifteenth side 31210 has a convex curve shape. The sixteenth side 3121 pis located between the first side 3121 a and the eighth side 3121 h, andconnects them. In the illustrated example, the sixteenth side 3121 p hasa convex curve shape. The seventeenth side 3121 q is located between theeighth side 3121 h and the second side 3121 b, and connects them. In theillustrated example, the seventeenth side 3121 q has a concave curveshape. The eighteenth side 3121 r is located between the second side3121 b and the ninth side 3121 i, and connects them. In the illustratedexample, the eighteenth side 3121 r has a convex curve shape.

The nineteenth side 3121 s is located between the ninth side 3121 i andthe tenth side 3121 j, and connects them. In the illustrated example,the nineteenth side 3121 s has a convex curve shape. The twentieth side3121 t is located between the third side 3121 c and the tenth side 3121j, and connects them. In the illustrated example, the twentieth side3121 t has a convex curve shape. The twenty-first side 3121 u is locatedbetween the third side 3121 c and the eleventh side 3121 k, and connectsthem. In the illustrated example, the twenty-first side 3121 u has aconvex curve shape. The twenty-second side 3121 v is located between theeleventh side 3121 k and the thirteenth side 3121 m, and connects them.In the illustrated example, the twenty-second side 3121 v has a convexcurve shape. The twenty-third side 3121 w is located between the sixthside 3121 f and the thirteenth side 3121 m, and connects them. In theillustrated example, the twenty-third side 3121 w has a convex curveshape. The twenty-fourth side 3121 x is located between the fifth side3121 e and the twenty-sixth side 3121 z, and connects them. In theillustrated example, the twenty-fourth side 3121 x has a convex curveshape. The twenty-fifth side 3121 y is located between the twenty-fourthside 3121 x and the twenty-ninth side 31213, and connects them. In theillustrated example, the twenty-fifth side 3121 y has a convex curveshape. The twenty-seventh side 31211 is located between the fourth side3121 d and the twenty-ninth side 31213, and connects them. In theillustrated example, the twenty-seventh side 31211 has a concave curveshape. The twenty-eighth side 31212 is connected to the fourth side 3121d. In the illustrated example, the twenty-eighth side 31212 has a convexcurve shape.

In the present embodiment, the pad part 3121 has a constricted shapesandwiched between the seventeenth side 3121 q and the twenty-seventhside 31211. The bonding part 4181 and the first wire 4182 are arrangedseparately from each other with the constricted part interposedtherebetween. Furthermore, a part sandwiched between the fifth side 3121e and the nineteenth side 3121 s has a constricted shape. The thirdsemiconductor light-emitting element 43 and the bonding part 4281 arearranged separately from each other with the constricted part interposedtherebetween.

Even in the present embodiment, it is possible to promoteminiaturization of the semiconductor light-emitting device A2.

Third Embodiment

FIGS. 18 to 20 illustrate a semiconductor light-emitting deviceaccording to a third embodiment of the present disclosure. Asemiconductor light-emitting device A3 of the present embodiment isdifferent from the aforementioned embodiments, mainly in theconfiguration of the main surface part 31 and the arrangement of thefirst semiconductor light-emitting element 41, the second semiconductorlight-emitting element 42, the third semiconductor light-emittingelement 43, the first wires 418, the second wires 428, and the thirdwire 438.

As illustrated in FIG. 17, the main surface part 31 of the presentembodiment includes a main surface first part 311, a main surface secondpart 312, a main surface third part 313, a main surface fourth part 314,and a main surface sixth part 316.

As illustrated in FIG. 18, the pad part 3111 of the present embodimenthas a first side 3111 a, a second side 3111 b, a third side 3111 c, afourth side 3111 d, a fifth side 3111 e, a sixth side 3111 f, a seventhside 3111 g, an eighth side 3111 h, a ninth side 3111 i, a tenth side3111 j, an eleventh side 3111 k, a twelfth side 31111, a thirteenth side3111 m, a fourteenth side 3111 n, and a fifteenth side 3111 o.

The first side 3111 a has a shape extending along the x direction. Thesecond side 3111 b has a shape extending along the x direction. Thesecond side 3111 b is located on one side of the first side 3111 a inthey direction. The third side 3111 c has a shape extending along the xdirection. The third side 3111 c is located on one side of the firstside 3111 a in the x direction and on the other side thereof in the ydirection. The fourth side 3111 d has a shape extending along the xdirection. The fourth side 3111 d is located on one side of the thirdside 3111 c in the y direction. Also, the fourth side 3111 d is locatedon one side of the second side 3111 b in the x direction and on theother side thereof in the y direction.

The fifth side 3111 e has a shape along they direction. The sixth side3111 f has a shape along they direction. The sixth side 3111 f islocated on one side of the third side 3111 c and the fourth side 3111 din the x direction. Also, the sixth side 3111 f is located between thethird side 3111 c and the fourth side 3111 d in they direction. Theseventh side 3111 g has a shape along they direction. The seventh side3111 g is located between the second side 3111 b and the fourth side3111 d in the x direction and they direction. The eighth side 3111 h hasa shape along the y direction. The eighth side 3111 h is located betweenthe first side 3111 a and the third side 3111 c in the x direction andthe y direction.

The ninth side 3111 i is connected to the other side of the first side3111 a in the x direction. In the illustrated example, the ninth side3111 i has a convex curve shape. The tenth side 3111 j is locatedbetween the first side 3111 a and the eighth side 3111 h. In theillustrated example, the first side 3111 a has a concave curve shape.The eleventh side 3111 k is located between the eighth side 3111 h andthe third side 3111 c. In the illustrated example, the eleventh side3111 k is curved. The twelfth side 31111 is located between the thirdside 3111 c and the sixth side 3111 f In the illustrated example, thetwelfth side 31111 has a convex curve shape. The thirteenth side 3111 mis located between the fourth side 3111 d and the seventh side 3111 g.In the illustrated example, the thirteenth side 3111 m has a concavecurve shape. The fourteenth side 3111 n is located between the secondside 3111 b and the seventh side 3111 g. In the illustrated example, thefourteenth side 3111 n has a convex curve shape. The fifteenth side31110 is located between the second side 3111 b and the fifth side 3111e. In the illustrated example, the fifteenth side 31110 has a convexcurve shape.

The pad part 3111 of the present embodiment has a constricted shapesandwiched between the twelfth side 31111 and the thirteenth side 3111m. The first semiconductor light-emitting element 41 and the secondsemiconductor light-emitting element 42 are arranged separately fromeach other with the constricted part interposed therebetween.

As illustrated in FIG. 19, the main surface second part 312 of thepresent embodiment has a pad part 3121, a first extension part 3122, andan edge part 3124.

The pad part 3121 is a part on which the third semiconductorlight-emitting element 43 is mounted. The pad part 3121 includes a firstside 3121 a, a second side 3121 b, a third side 3121 c, a fourth side3121 d, a fifth side 3121 e, a sixth side 3121 f, and a seventh side3121 g.

The first side 3121 a has a shape extending along the x direction. Thesecond side 3121 b has a shape extending along the x direction, and islocated on one side of the first side 3121 a in they direction. Thethird side 3121 c has a shape extending along they direction. The thirdside 3121 c is located between the first side 3121 a and the second side3121 b in they direction. The fourth side 3121 d has a shape along theydirection. The fourth side 3121 d is located on one side of the thirdside 3121 c in the x direction. Also, the fourth side 3121 d is locatedbetween the first side 3121 a and the second side 3121 b in theydirection.

The fifth side 3121 e is interposed between the second side 3121 b andthe third side 3121 c, and connects them. In the illustrated example,the fifth side 3121 e has a convex curve shape. The sixth side 3121 f isinterposed between the third side 3121 c and the first side 3121 a, andconnects them. In the illustrated example, the sixth side 3121 f has aconvex curve shape. The seventh side 3121 g is interposed between thefirst side 3121 a and the fourth side 3121 d, and connects them. In theillustrated example, the seventh side 3121 g has a convex curve shape.

The first extension part 3122 extends from the pad part 3121 toward thegroove part 27. The first extension part 3122 includes a first side 3122a and a second side 3122 b. The first side 3122 a is connected to thesecond side 3121 b of the pad part 3121, and has a concave curve shapein the illustrated example. The second side 3122 b is connected to thefourth side 3121 d of the pad part 3121, and has a concave curve shapein the illustrated example.

The edge part 3124 is connected to the first extension part 3122, andhas a shape along the groove part 27 of the base 2 as viewed in the zdirection. In the illustrated example, the edge part 3124 has a firstside 3124 a, a second side 3124 b, and a third side 3124 c.

The first side 3124 a has a convex arc shape, and is located on one sideof the second side 3121 b of the pad part 3121 in they direction in theillustrated example. The second side 3124 b has a convex arc shape, andis installed on the opposite side of the first side 3124 a with thefirst extension part 3122 interposed therebetween. The first side 3124 aand the second side 3124 b have a relationship that forms the same arcwhen they are each extended. The third side 3124 c has a concave arcshape. The third side 3124 c is installed near the groove part 27 withrespect to the first side 3124 a and the second side 3124 b.

As illustrated in FIG. 20, the main surface sixth part 316 includes apad part 3161, a first extension part 3162, a second extension part3163, and an edge part 3164.

The first wire 418, the second wire 428, and the third wire 438 areconnected to the pad part 3161. The pad part 3161 includes a first side3161 a, a second side 3161 b, a third side 3161 c, a fourth side 3161 d,a fifth side 3161 e, a sixth side 3161 f, a seventh side 3161 g, aneighth side 3161 h, a ninth side 3161 i, a tenth side 3161 j, aneleventh side 3161 k, a twelfth side 31611, and a thirteenth side 3161m.

The first side 3161 a has a shape along the x direction. The second side3161 b has a shape along the x direction. The second side 3161 b islocated on one side of the first side 3161 a in they direction. Thethird side 3161 c has a shape along the x direction. The third side 3161c is located on one side of the first side 3161 a in the x direction andon the other side thereof in they direction. The fourth side 3161 d hasa shape along the x direction. The fourth side 3161 d is located on oneside of the third side 3161 c in they direction. Also, the fourth side3161 d is located on one side of the second side 3161 b in the xdirection, and thus has substantially the same position in the ydirection.

The fifth side 3161 e has a shape along they direction. The fifth side3161 e is located between the first side 3161 a and the second side 3161b in they direction. The sixth side 3161 f has a shape along theydirection. The sixth side 3161 f is located between the first side 3161a and the third side 3161 c in the x direction and they direction. Theseventh side 3161 g has a shape along they direction. The seventh side3161 g is located between the third side 3161 c and the fourth side 3161d in the y direction.

The eighth side 3161 h is interposed between the fifth side 3161 e andthe first side 3161 a, and connects them. In the illustrated example,the eighth side 3161 h has a convex curve shape. The ninth side 3161 iis interposed between the first side 3161 a and the sixth side 3161 f,and connects them. In the illustrated example, the ninth side 3161 i hasa concave curve shape. The tenth side 3161 j is interposed between thesixth side 3161 f and the third side 3161 c, and connects them. In theillustrated example, the tenth side 3161 j has a convex curve shape. Theeleventh side 3161 k is interposed between the third side 3161 c and theseventh side 3161 g, and connects them. In the illustrated example, theeleventh side 3161 k has a convex curve shape. The twelfth side 31611 isinterposed between the seventh side 3161 g and the fourth side 3161 d,and connects them. In the illustrated example, the twelfth side 31611has a convex curve shape. The thirteenth side 3161 m is connected to thefifth side 3161 e. In the illustrated example, the thirteenth side 3161m has a concave curve shape.

The first extension part 3162 extends from the pad part 3161 toward thegroove part 27. The first extension part 3162 includes a first side 3162a and a second side 3162 b. The first side 3162 a is connected to thethirteenth side 3161 m of the pad part 3161, and has a shape along the xdirection in the illustrated example. The second side 3162 b isconnected to the second side 3161 b of the pad part 3161, and has a partalong the x direction and a part having a concave curve shape in theillustrated example.

The second extension part 3163 extends from the pad part 3161 to oneside in the y direction, and reaches the end edge (fourth surface 26) ofthe main surface 21 in they direction. The second extension part 3163includes a first side 3163 a and a second side 3163 b. The first side3163 a is connected to the second side 3161 b of the pad part 3161, andhas a concave curve shape in the illustrated example. The second side3163 b is connected to the fourth side 3161 d of the pad part 3161, andhas a concave curve shape in the illustrated example.

The edge part 3164 is connected to the first extension part 3162, andhas a shape along the groove part 27 of the base 2 as viewed in the zdirection. In the illustrated example, the edge part 3164 includes afirst side 3164 a, a second side 3164 b, and a third side 3164 c.

The first side 3164 a has a convex arc shape, and is connected to thesecond side 3162 b of the first extension part 3162 in the illustratedexample. The second side 3164 b has a convex arc shape, and is installedon the opposite side of the first side 3164 a with the first extensionpart 3122 interposed therebetween. The first side 3164 a and the secondside 3164 b have a relationship that forms the same arc when they areeach extended. The third side 3164 c has a concave arc shape. The thirdside 3164 c is installed near the groove part 27 with respect to thefirst side 3164 a and the second side 3164 b.

In the present embodiment, the bonding part 4181 of the first wire 418is arranged between the first side 3161 a and the second side 3161 b.Also, the bonding part 4281 is arranged between the sixth side 3161 fand the seventh side 3161 g. Further, the bonding part 4381 is arrangedon one side of the bonding part 4181 in the x direction and on one sideof the bonding part 4281 in the y direction.

Furthermore, in the third semiconductor light-emitting element 43 of thepresent embodiment, the configuration of the electrode 431 and theelectrode 432 is reversed, as compared with the third semiconductorlight-emitting element 43 of the semiconductor light-emitting device A1,in which the electrode 431 is an anode electrode and the electrode 432is a cathode electrode.

Even in the present embodiment, it is possible to promoteminiaturization of the semiconductor light-emitting device A3. Inaddition, according to the present embodiment, the first wires 418, thesecond wires 428, and the third wire 438 can be connected to the padpart 3161, which is suitable for miniaturization.

The semiconductor light-emitting device according to the presentdisclosure is not limited to the aforementioned embodiments. Thespecific configuration of the respective parts of the semiconductorlight-emitting device according to the present disclosure may bevariously modified in design.

[Supplemental Note 1]

A semiconductor light-emitting device, including:

a substrate having a base and a conductive part;

a first semiconductor light-emitting element, a second semiconductorlight-emitting element, and a third semiconductor light-emitting elementsupported by the substrate;

at least one first wire connected to the first semiconductorlight-emitting element, at least one second wire connected to the secondsemiconductor light-emitting element, and a third wire connected to thethird semiconductor light-emitting element; and

a light-transmitting resin part covering the first semiconductorlight-emitting element, the second semiconductor light-emitting element,and the third semiconductor light-emitting element,

wherein the base has a main surface and a rear surface facing oppositesides to each other in a thickness direction of the base,

wherein the conductive part includes a main surface part formed on themain surface,

wherein the main surface part includes a main surface first part onwhich the first semiconductor light-emitting element and the secondsemiconductor light-emitting element are mounted,

wherein the main surface first part reaches both ends of the mainsurface in a first direction perpendicular to the thickness direction ofthe base, and

wherein the main surface first part is separated from both a part of themain surface part on which the third semiconductor light-emittingelement is mounted and a part of the main surface part to which the atleast one first wire, the at least one second wire, and the third wireare connected.

[Supplemental Note 2]

The device of Supplemental Note 1, wherein the first semiconductorlight-emitting element and the second semiconductor light-emittingelement are bonded to the main surface first part by an insulatingbonding material.

[Supplemental Note 3]

The device of Supplemental Note 2, wherein the third semiconductorlight-emitting element is bonded to the main surface part by aconductive bonding material.

[Supplemental Note 4]

The device of Supplemental Note 3, wherein the base has a plurality ofgroove parts extending in the thickness direction, and wherein theconductive part includes a rear surface part formed on the rear surface,and a plurality of connection parts formed in the groove parts andconfigured to electrically connect a portion of the main surface partand a portion of the rear surface part.

[Supplemental Note 5]

The device of Supplemental Note 4, wherein the main surface first partis separated from the plurality of connection parts.

[Supplemental Note 6]

The device of Supplemental Note 5, wherein the main surface first partincludes: a first pad part on which the first semiconductorlight-emitting element and the second semiconductor light-emittingelement are mounted; and a first extension part and a second extensionpart extending from the first pad part to both ends of the main surfaceon both sides in the first direction.

[Supplemental Note 7]

The device of Supplemental Note 6, wherein the at least one first wireincludes two first wires connected to the first semiconductorlight-emitting element; and wherein the at least one second wireincludes two second wires connected to the second semiconductorlight-emitting element.

[Supplemental Note 8]

The device of Supplemental Note 7, wherein the first semiconductorlight-emitting element and the second semiconductor light-emittingelement are arranged side by side in the first direction.

[Supplemental Note 9]

The device of Supplemental Note 8, wherein the main surface partincludes a main surface second part located on one side of the firstsemiconductor light-emitting element and the second semiconductorlight-emitting element in a second direction perpendicular to thethickness direction and the first direction, and wherein the thirdsemiconductor light-emitting element is mounted on the main surfacesecond part, and one of the first wires and one of the second wires areconnected thereto.

[Supplemental Note 10]

The device of Supplemental Note 9, wherein the main surface second partincludes: a second pad part on which the third semiconductorlight-emitting element is mounted and to which the one of the firstwires and the one of the second wires are connected;

an edge part connected to the connection parts; and

a first extension part connected to the second pad part and the edgepart.

[Supplemental Note 11]

The device of Supplemental Note 10, wherein the main surface second partincludes a second extension part extending from the second pad part toone opposite side of the main surface first part in the seconddirection.

[Supplemental Note 12]

The device of Supplemental Note 11, wherein the main surface partincludes a main surface third part to which the other first wire isconnected and a main surface fourth part to which the other second wireis connected.

[Supplemental Note 13]

The device of Supplemental Note 7, wherein the first semiconductorlight-emitting element and the second semiconductor light-emittingelement are arranged side by side and inclined with respect to the firstdirection.

[Supplemental Note 14]

The device of Supplemental Note 13, wherein the main surface partincludes a main surface second part located on one side of the secondsemiconductor light-emitting element in a second direction perpendicularto the thickness direction and the first direction, and wherein thethird semiconductor light-emitting element is mounted on the mainsurface second part.

[Supplemental Note 15]

The device of Supplemental Note 14, wherein the main surface partincludes a main surface sixth part located on one side of the secondsemiconductor light-emitting element in the second direction andconnected to one of the first wires and one of the second wires.

[Supplemental Note 16]

The device of Supplemental Note 15, wherein the main surface partincludes a main surface third part to which the other first wire isconnected and a main surface fourth part to which the other second wireis connected.

[Supplemental Note 17]

The device of Supplemental Note 16, wherein the main surface second partand the main surface sixth part are electrically connected to theconnection parts different from each other.

According to the present disclosure in some embodiments, it is possibleto promote miniaturization of a semiconductor light-emitting device.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosures. Indeed, the embodiments described herein maybe embodied in a variety of other forms. Furthermore, various omissions,substitutions and changes in the form of the embodiments describedherein may be made without departing from the spirit of the disclosures.The accompanying claims and their equivalents are intended to cover suchforms or modifications as would fall within the scope and spirit of thedisclosures.

1-17. (canceled)
 18. A semiconductor light-emitting device, comprising:a substrate having a base and a conductive part; a first semiconductorlight-emitting element; a second semiconductor light-emitting element;two first wires connected to the first semiconductor light-emittingelement; and two second wires connected to the second semiconductorlight-emitting element, wherein the base has a main surface, wherein theconductive part includes a main surface part formed on the main surface,and the main surface part includes a first part, a second part, a thirdpart, and a fourth part, wherein the first semiconductor light-emittingelement and the second semiconductor light-emitting element are mountedon the first part, wherein the first part reaches both ends of the mainsurface in a first direction perpendicular to a thickness direction ofthe base, wherein the second part is located on one side, and the thirdpart and the fourth part are located on the other side with respect tothe first semiconductor light-emitting element and the secondsemiconductor light-emitting element, in a second directionperpendicular to the thickness direction and the first direction,wherein one of the two first wires and one of the two second wires areconnected to the second part, wherein the other of the two first wiresis connected to the third part, and wherein the other of the two secondwires is connected to the fourth part.
 19. The device of claim 18,wherein the first semiconductor light-emitting element and the secondsemiconductor light-emitting element are bonded to the first part by aninsulating bonding material.
 20. The device of claim 19, furthercomprising: a third semiconductor light-emitting element that is bondedto the main surface part by a conductive bonding material.
 21. Thedevice of claim 20, wherein the base has a rear surface such that themain surface and the rear surface face opposite sides from each other inthe thickness direction, wherein the base has a plurality of grooveparts extending in the thickness direction, and wherein the conductivepart includes a rear surface part formed on the rear surface, and aplurality of connection parts formed in the groove parts and configuredto electrically connect a portion of the main surface part and a portionof the rear surface part.
 22. The device of claim 21, wherein the firstpart is separated from the plurality of connection parts.
 23. The deviceof claim 22, wherein the first part includes: a first pad part on whichthe first semiconductor light-emitting element and the secondsemiconductor light-emitting element are mounted; and a first extensionpart and a second extension part extending from the first pad part toboth ends of the main surface on both sides in the first direction. 24.The device of claim 23, wherein the first semiconductor light-emittingelement and the second semiconductor light-emitting element are arrangedside by side in the first direction.
 25. The device of claim 24, whereinthe third semiconductor light-emitting element is mounted on the secondpart.
 26. The device of claim 25, wherein the second part includes: asecond pad part on which the third semiconductor light-emitting elementis mounted and to which the one of the first wires and the one of thesecond wires are connected; an edge part connected to the connectionparts; and a first extension part connected to the second pad part andthe edge part.
 27. The device of claim 26, wherein the second partincludes a second extension part extending from the second pad part toone opposite side of the first part in the second direction.
 28. Thedevice of claim 23, wherein the first semiconductor light-emittingelement and the second semiconductor light-emitting element are arrangedside by side and inclined with respect to the first direction.
 29. Thedevice of claim 28, wherein the main surface part includes a sixth partlocated on one side of the second semiconductor light-emitting elementin the second direction and connected to one of the first wires and oneof the second wires.
 30. The device of claim 29, wherein the second partand the sixth part are electrically connected to the connection partsdifferent from each other.